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1. general description the UBA20270 is a high-voltage power ic intended to control higher powered self ballasted compact fluorescent lamp (cfl) lighting applications. the UBA20270 is a controller circuit with advanced features for dimming and has a lamp current controlled boost feature for boosting cold (amalgam) cfls. the controller contains a half-bridge drive fu nction for cfl, a high-voltage level-shift circuit with integrated bootstrap diode. in addition, the controller contains an oscillator function, a current control function both for preheat and burn, a timer function and protection circuits. the UBA20270 is supplied via a dv/dt current charge supply circuit from the half-bridge circuit. remark: ma in s voltages noted are ac. 2. features and benefits 2.1 half-bridge features ? integrated high-voltage level-shift function with integrated bootstrap diode 2.2 preheat and ignition features ? coil saturation protection during ignition ? adju stable preheat time ? ad justable preheat current ? ign ition lamp current detection 2.3 lamp boost features ? adjustable boost timing ? fixed boost current ratio of 1.5 ? grad ually boost to burn transition timing 2.4 dim features ? continuously variable dimming function for standard phase cut dimmers ? natur al dimming curve by logarithmic correction ? ad justable minimum dimming level (mdl) ? controlled lamp on/off UBA20270 600 v driver ic for dimmab le compact fluorescent lamps rev. 2 ? 8 september 2011 product data sheet
UBA20270 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 8 september 2011 2 of 32 nxp semiconductors UBA20270 600 v driver ic for dimmable compact fluorescent lamps 2.5 protection ? overcurrent protection (ocp) in boost and burn state ? cap acitive mode protection (cmp) ? overpower prot ection (opp) ? powe r-down function ? ove rtemperature protection (otp) 2.6 other features ? current controlled operating in boost and burn state ? exte rnal power-down function ? l amp flicker suppression 3. applications ? dimmable compact fluorescent lamps for power levels above 20 w and for universal mains vo ltages. 4. ordering information table 1. ordering information type number package name description version UBA20270t/n1 so16 plastic small outline package; 16 leads; body width 3.9 mm sot109-1
xxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx x xxxxxxxxxxxxxx xxxxxxxxxx xxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxx xx xxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxx xxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxx xxxxxxxxxxxxxx xxxxxx xx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxx xxxxx x x UBA20270 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 8 september 2011 3 of 32 nxp semiconductors UBA20270 600 v driver ic for dimmable compact fluorescent lamps 5. block diagram fig 1. block diagram level shift bootstrap fs logic v ph(sls) 25 a 25 a v th(det)ign(csi) logic pgnd dimmer control dci level shifter hs driver ls driver sls reference current 1.27 v rref cf ci csi frequency control logic dsr ota lamp current sensor boost amplifier boost enable ignition current detector start enable voltage controlled oscillator vco i v temperature sensor 160 120 80 divide by 2 logic driver logic v dd supply 5 v digital reference voltages 5 v 1 a 6 a logic counter preheat/ boost timer vs low reset 60 a v clamp (csi) cp cb sgnd 12 v th(capm)sls v th(ocp)sls 001aam663 mdl v otp(csi) v ld v th(bst) (dci) v th(start) (dci) v t(hec1) dci dci 13 11 4 14 ghs 16 3 10 7 9 8 6 5 1 hbo 15 gls 2 reset state start-up state preheat state ignition state hold state boost state burn state power-down state state logic 5 v analog inductor saturation/ overcurrent detector preheat current sensor capacitive mode detector
UBA20270 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 8 september 2011 4 of 32 nxp semiconductors UBA20270 600 v driver ic for dimmable compact fluorescent lamps 6. pinning information 6.1 pinning 6.2 pin description fig 2. pin configuration (so16) UBA20270 sls ghs gls hbo pgnd fs v dd sgnd rref cb cf cp mdl dci ci csi 001aam664 1 2 3 4 5 6 7 8 10 9 12 11 14 13 16 15 table 2. pin description symbol pin description sls 1 source low-side switch input gls 2 low-side gate driver output pgnd 3 power ground v dd 4 low voltage supply rref 5 internal reference current input cf 6 voltage controlled oscillator capacitor mdl 7 minimum dimming level input ci 8 voltage controlled oscillator input integrating capacitor csi 9 current feedback sense input dci 10 dimming level input cp 11 preheat timing capacitor cb 12 boost timing capacitor sgnd 13 signal ground fs 14 floating supply voltage hbo 15 half-bridge output ghs 16 high-side gate driver output
UBA20270 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 8 september 2011 5 of 32 nxp semiconductors UBA20270 600 v driver ic for dimmable compact fluorescent lamps 7. functional description the UBA20270 is an ic for driving external half-bridge mosfets in self ballasted high-power cfl and their derivatives. the u ba20270 is equipped with a dimming control input that has a logarithmic corrected natural dimming function. this function enables a less sensitive brightness control of the lamp at low dim levels. the UBA20270 is rated up to a maximum co ntinu ous re ctified mains voltage of 500 v (pea k 600 v). the UBA20270 includes all the necessary functions for preheat, ignition, boost, an d on-state operation of the lamp. in addition, the UBA20270 includes several protection measures that safeguard the fu nctioning of the cfl and controller. the controller states are shown in figure 3 . (1) v dd > v dd(start) and v i(dci) > v th(start)dci and (hold = 0 or v cp < v th(rel)cp ) (2) v dd < v dd(stop) or v i(dci) < v th(start)dci ? v th(hys)dci (3) (end of ignition time and hold = 0) or v dd < v dd(stop) or v i(dci) < v th(start)dci ? v th(hys)dci (4) end of ignition time and hold = 1 (5) v cp < v th(pd)cp or overcurrent fault time > 1 10 t ph or f bridge(max) detected in capacitive mode (6) v dd < v dd(stop) or v i(dci) < v th(start)dci ? v th(hys)dci fig 3. state diagram 001aam665 v dd = 0 reset state hold = 0 start-up state preheat state ignition state hold state hold = 1 power-down state boost and burn states preheat time completed ignition_detected v dd > v dd(rst) v dd < v dd(rst) v dd < v dd(rst) v cp < v th(rel)cp (3) (2) (1) (4) (5) (6)
UBA20270 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 8 september 2011 6 of 32 nxp semiconductors UBA20270 600 v driver ic for dimmable compact fluorescent lamps 7.1 lamp start-up cycle 7.1.1 reset state the UBA20270 is in a reset state while the supply voltage on the v dd pin is below the v dd(rst) level. in the reset state, a part of the internal s upply is turned off, all registers, counters and timers are undefined. in additio n, the hold state latch is reset and both the applied external high and low-side transis tor (q1, q2) are non-conductive. during power-up, the low voltage supply capacitor on the v dd pin is charged via an external start-up resistor. when the voltage on the v dd pin is above the v dd(rst) level, the start-up state is entered. the UBA20270 enters the reset state when the supply voltage on the v dd pin drops lower than v dd(rst) . 7.1.2 start-up state start-up is achieved by charging the low voltage supply capacitor on the v dd pin via an external start-up resistor. at start-up the hi gh-side (hs) transistor is non-conductive and the low-side (ls) is conductive to enable charging of the bootstrap capacitor. this capacitor supplies the hs driv er and level shifter circuit connected between the fs and hbo pin. a dc reset circuit is incorporated in the ics hs driver. this circuit ensures that lower than the lockout voltage on the fs pin the output voltage (v ghs - v hbo ) is zero. as the start-up state is entered, the circui t only s t arts oscillating when the low voltage supply (v dd ) reaches the value of v dd(start) and v i(dci) > v th(start)dci . the circuit starts oscillating at f bridge(max) . the circuit enters the preheat st ate as soon as the capacitor on the cp pin is charged to a voltage level above v th(cp)max . to remain oscillating, the v dd voltage must remain higher than v dd(stop) and lower than the upper limit v dd(clamp) . in addition, the typical voltage level on the dci pin must be higher than v th(start)dci ? v th(hys)dci = 0.24 v. an undervoltage lockout (uvlo) is implemented on the dci pin to create a guaranteed turn-of f for multiple lamps when the lamp s are at low dim levels. the uvlo also guarantees that there is a preheat phase when the dim level is turned up again. the typical turn-on level on the dci pin is set to lower than v th(start)dci = 0.36 v, else it incr eases the turn-on hysteresis of the lamp. this level enables the UBA20270 to perform a stable ignition of the lamp when there is already sufficient power from the dimmer at lower dim levels. during the start-up state, the voltage on the cf pin is at zero and the cb pin is close to ze ro . the voltage on the cp pin rises to higher than v th(cp)max level during the start-up state. see figure 9 . 7.1.3 preheat state starting at f bridge(max) , the frequency decreases by charging capacitor c ci via an output current circuit controlled by the preheat current sensor circuit. this state continues until the momentary value of the voltage across sense resistor r sls reaches the internally fixed preheat voltage level (sls pin). at this level, the current of the preheat current sensor reaches a charge and discharge balanced state on capacitor c ci to set the frequency.
UBA20270 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 8 september 2011 7 of 32 nxp semiconductors UBA20270 600 v driver ic for dimmable compact fluorescent lamps the preheat time consists of eight saw-toothe d pulses at the cp pin. preheat begins as soon as the capacitor on the cp pin is charged to a voltage higher than v th(cp)max . during the preheat time, the current feedback sensor circuit (input csi pin) is disabled. to incr ease noise immunity, an internal filter of 30 ns is included at the sls pin. if during preheat, the level on the dci pin drops lower than v th(start)dci ? v th(hys)dci = 0.24 v or the v dd pin drops lower than v dd(stop), the preheat state is immediately stopped. the circuit enters the hold state delaying a new preheat cycle. a fixed voltage drop on the preheat capacitor c cp and a fixed discharge current on the cp pin sets the delay time. a new preheat cycle starts after the cp pi n level slowly dischar ges. this condition continues until v cp < v th(rel)cp and recharges higher than v th(cp)max provided v dd > v dd(start) and v i(dci) > v th(start)dci . see figure 5 . 7.1.4 ignition state directly after the preheat state has been completed, the ignition state is entered. in the ignition state, the frequency sweeps do wn due to charging of the capacitor c ci on the ci pin with an internally fixed current. see figure 4 . during this continuous decrease in frequency, the circuit approaches the resonant freque ncy of the resonant tank l2, c5. this results in a high voltage across the lamp to ignite the lamp. the current sensor circuit which monitors the voltage over resistor r csi detects lamp ignition. see figure 11 . if the voltage on the csi pin is above the typical ignition detection threshold voltage level o f 0.6 v, lamp ignition is detected. the syst em then changes from ignition state to the boost or burn state. if no ignition is detected, the frequency decreases further to the minimum half-bridge frequency f bridge(min) . to prevent continuous ignition attempts and over-heating of the application due to lamp da mage, the UBA20270 only attempts to ignite the lamp twice after power-up. the ignition attempt counter is incremented when the lamp ignition threshold voltage on the csi pin is not exceeded at the end of the ignition enabling time. if a second ignition attempt also exceeds the ignition time-out period, the ic enters the power-down state. see figure 5 . fig 4. cfl frequency from start to burn state boost ignition burn transition preheat 100 f (khz) start frequency preheat frequency cfl ignition time (s) 100 % 001aam764 boost bottom ~22 khz a c b
UBA20270 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 8 september 2011 8 of 32 nxp semiconductors UBA20270 600 v driver ic for dimmable compact fluorescent lamps 7.1.5 boost state and transition to burn state when ignition is detected by measuring lamp cu rrent on the csi pin, the circuit enters the boost state. figure 7 shows the boost and burn state in mo re detail. in the boost state, the nominal burn state lamp current can be increase d with a fixed boost ratio of 1.5:1. this boosts up the slow luminescence increase of a cold amalgam cfl lamp , provided v dci > v th(bst)dci . if the ic is at a temperature (t j(bp)bst ) before entering the boost state, the burn state is bypassed. a boost timing circuit is included to determine th e bo ost time and transition to burn time. the circuit consists of a clock generator comprising c cb , r ext(rref) and a 64-step counter. when the timer is not operating, c cb is discharged to lower than the v th(cb)min level of 1.1 v . this voltage, about 0.6 v, is still higher than the leve l at which the comparator on c cb detects if the cb pin is shorted to ground. the boost time consists of 63 saw-toothe d pulses at th e cb pin and automatically followed by the transition time at the cp pin. the 32 saw-tooth pulses form the transition time from boost to burn enabling a smooth transition between the current controlled boost and burn state. the total transition time is approximately four times the preheat time as shown in figure 6 . fig 5. retry cycle 001aan537 voltage (v) v cp v th(cp)max 5 v 0 v v th(cp)min v th(rel)cp t ph t ph restart delay time startup time t en(ign) t en(ign) 2 nd startup t d(restart) discharge to 0 v time (s) 1 st preheat time 1 st ignition enabling time 2 nd ignition enabling time 2 nd preheat time 2 nd failed ignition attempt 1 st failed ignition attempt power down state hold state
UBA20270 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 8 september 2011 9 of 32 nxp semiconductors UBA20270 600 v driver ic for dimmable compact fluorescent lamps in the boost state, the lamp cu rrent feedback control circuit operates the same as in the burn state. this action is us ed to improve lamp stability. la mp current boosted by a fixed ratio of 1.5 compared to the burn state, boos ts up the slow luminescence increase of a cold cfl lamp. in the boost to burn transition time there is a slow 15-step ratio decrease from 1.5 to 1. for the transition to burn ti me, the preheat timer is reused and the boost ratio is gradually decreased in 15 steps from 1.5 to 1. the steps occur within 32 saw-toothed pulses on the cp pin. the 32 saw-toothed pulses form the transition time from boost to burn to enable a smooth transit ion between the current controlled boost and burn state. given the application values of c cb and r ext(rref) a boost time of more than 300 s is possible. in addition to boost bypass at temperature t j(bp)bst ( ? 80 ? c), there is a temp erature protection function during the boost state of t j(end)bst ( ? 120 ? c). if the ic temp erature passes this level during boost, th e transition timer is immediately started in order to enter the burn state faster. this ac tion effectively reduces the boost time. see figure 4 [b]. the current boost in the boost state does not start when v i(dci) is lower than v th(bst)dci . current boost ends when v i(dci) is lower than v th(bst)dci ? v th(bst)hys(dci) without a boost transition. see figure 4 [a]. remark: if the cb pin is shorted to ground, the boost function is dis abled. during such conditions, the bottom frequency f bridge(min) is 1.8 times higher than the boost bottom frequency f bridge(bst)min . 7.1.6 burn state after the boost state, or when the boost state is bypassed burn state starts. the lamp current sensor circuit is still enabled. see figure 4 [a]. the csi pin (current sense input) measures the rms voltage across sense resistor r csi . it then passes through a double-sided rectifie r (dsr) circuit and fed towards an operational transconductor amplifier (ota). when the rms voltage on the csi pin reaches the internal reference level, the lamp current sensor circuit takes over the control of the lamp current. the fig 6. boost timing 001aam765 voltage (v) 5 v v cb v cp v th(cp)max 4.5 v v th(cp)min 3.8 v v th(cb)max 3.6 v v th(cb)min 0.6 v 1 ignition boost transition burn time (s) 132 2616263 0 v 1.1 v
UBA20270 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 8 september 2011 10 of 32 nxp semiconductors UBA20270 600 v driver ic for dimmable compact fluorescent lamps internal current output of the ot a is transferred via an integrat or on the ci pin to the input of the voltage controlled oscillator (vco). the vc o regulates the fr equency and as a result, the la mp current. 7.1.7 hold state the hold state is a special state to reduce lamp flicker at deep dim levels, on or near dim and ignition threshold level. see figure 3 . the hold state is entered following: ? a failed ignition attempt ? or when the low supply voltage v dd is lower than v dd(stop) in the ignition or preheat state ? or when v dci < v th(start)dci ? v th(hys)dci in the ignition or preheat state a repeated aborted preheat or ignition cycle due to a drop in dci voltage that is lower than v th(start)dci ? v th(hys)dci or a drop in supply voltage that is lower than v dd(stop) in preheat or ignition state does not increment the ignition attempt counter. the uba20271/2 enters the hold state only delaying a ne w preheat cycle by the same time delay and mechanism. as shown in figure 5 hold state retention time. (1) temp > t j(bp)bst or boost_disable (2) temp < t j(bp)bst and not boost_disable (3) not (boost or boost transition) (4) temp > t j(end)bst or boost timer ended or (boost_ratio = 1.5 and v dci < v th(bst)dci - v th(bst)hys(dci) ) (5) boost_transition timer ended or v dci < v th(bst)dci ? v th(bst)hys(dci) or temp > t j(otp) fig 7. boost and burn state machine 001aam668 boost and burn states 01 boost boost timer running boost_ratio = 1 boost_ratio = 1.5 11 boost transition 00 burn select 10 burn temp < (t j(otp) - t j(otp)hys (3) v i(dci) > v th(bst)dci and boost (1) (4) (5) (2) temp > (t j(otp) v i(csi) = v otp(csi) (66 % level) v i(csi) = v clamp(csi) (100 % level)
UBA20270 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 8 september 2011 11 of 32 nxp semiconductors UBA20270 600 v driver ic for dimmable compact fluorescent lamps when cp is lower than v th(rel)cp, the ic is released from the hold state and moves to the start-up state. see figure 3 . alternatively, the hold state ends when the supply voltage is lower than v dd(rst) and the ic is reset. with a 470 nf capacitor on the cp pin, the typical hold state retention delay is between 1 . 0 seconds and 1.7 seconds. however, it depends on where the preheat cycle is cut off on the rising or falling edge of the preheat timing. the retent ion time for a failed ignition always starts from the top of the rising edge on the cp pin. see figure 5 . in the hold state, a latch is set (hold state latch = 1), the oscillator is sto pped, transi stor hs is non-conductive and transistor ls conducting. the voltage on pin v dd alternates between v dd(start) and v dd(stop) as long as the voltage on the cp pin has not reached v th(rel)cp. see figure 5 . the alternating supply voltage is a result of th e cu rrent drawn by the ic supply pin v dd . the supply current is less than 220 ? a, when the supply voltage v dd is increasing between v dd(stop) and v dd(start) . the supply current is typically 2 ma when v dd is decreasing between v dd(start) and v dd(stop) . more current is drawn during the decreasing slope of v dd as the internal analog supply is turned on when v dd > v dd(start) . this condition enables comparators in the ic to mo nitor the voltage on the cp pin and whether the supply voltage v dd decreases lo wer than v dd(stop) . 7.2 oscillation and timing 7.2.1 oscillation the internal oscillator is a vco circuit whic h generates a sawtooth waveform between the v th(cf)max level and 0 v. capacitor c cf , resistor r ext(rref) , and the voltage at the ci pin determine the frequency of the sawtooth. r ext(rref) and c cf determine the minimum and maximum switching frequencies. their ratio is internally fixed. there are two ratios, the ratio between f bridge(max) and f bridge(min) is 2.5 and the ratio between f bridge(max) and f bridge(bst)min is 4.6. the sawtooth frequency is twice the half-bridge frequency. transistors hs (q1) and ls (q2) are bro ugh t into conduction with a duty cycle of approximately 50 %. figure 8 provides an overview of the oscillator signal and driver signals. the oscillator starts oscillating at f bridge(max) . the non-overlap time between the gate drive signals v gls and v ghs is t no .
UBA20270 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 8 september 2011 12 of 32 nxp semiconductors UBA20270 600 v driver ic for dimmable compact fluorescent lamps 7.2.2 combined timing circuit a combined timing circuit is included to determine the preheat time, ignition enabling time and overcurrent time, see figure 9 . the circuit consists of a clock generator defined by c cp and r ext(rref) and a counter. when the timer is not operating, c cp is charged to 5 v. th e timing circuit starts oper ating after the start-up state, as soon as the low supply voltage has reached v dd(start). additionally the dci input voltage must be higher than v th(start)dci and the voltage on the cp pin must pass v th(cp)max . the preheat time consists of eight saw-tooth pulses on the cp pin as shown in figure 9 . the maximum ignition enabling time following the preheat phase is two comple te sawtooth (triangular) pulses. during the boost and burn state, part of the timer is used to generate the maximum overcurrent time (more than one half of the saw-toothed pulse). if a continuous overcurrent is detect ed, the timer starts. fig 8. sawtooth, gate driver and half-bridge output signals 001aam766 0 t dch 0 0 0 v cf voltage (v) v (ghs-hbo) v gls v hbo t no time (s) t no
UBA20270 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 8 september 2011 13 of 32 nxp semiconductors UBA20270 600 v driver ic for dimmable compact fluorescent lamps 7.3 natural linear dimming what determines the actual internal set poin t level used for the current control feedback loop is an external level applied via the dci pin for dimming. the dci voltage is a function of the phase cut angle of the applied dimmer. to ensure that the external input for the control on the dci pin internally stays within a certain range, this input signal passes an internal linear to logarithmic conversion circuit followed by a limiting circuit. the linear to logarithmic conversion circuit is de sig ned to improve dimming control by correcting for the higher sensitivity of the hu man eye to small changes in low light levels. see figure 10 . the conversion circuit also provides a natural perceived linear brightness adjustment of the lamp. the limiting circuit prevents the signal falli ng b e low the mdl or rising above the 100 % reference leve l of v clamp(csi). the output of the linear to loga rithmic conversion circuit is the actual reference voltage for the lamp current control loop. see signal v ld in figure 1 (dimmer control block). when the ic is in the burn state, the voltage is equal to the rms voltage on the csi pin. when the control loop is regulating correctly, the upper limit is clamped at the 100 % reference level. this condition prevents l amp current values that are too high in mains overvoltage situations. see figure 10 . the mdl level presets a minimum to which the la mp current clips at lo w dim levels and is adjustable via the mdl pin. an accurate minimum dimming voltage level is set by using an internal reference current (derived from the internal band gap reference circuit and resistor r ext(rref) ) and an applied external resistor r mdl on the mdl pin. fig 9. timing diagram preheat, ignition and overcurrent 001aam768 voltage (v) 5 v 0 v 4.5 v 3.8 v v cp startup time preheat time boost-burn power down overcurrent fault time cfl ignition ignition time ignition enabling time time (s) v th(cp)max v th(cp)min
UBA20270 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 8 september 2011 14 of 32 nxp semiconductors UBA20270 600 v driver ic for dimmable compact fluorescent lamps 7.4 protection and power-down 7.4.1 coil saturation protection coil saturation protection is in tegrated into the ic to allow for the use of small cfl lamps and use of small coils. saturation of these coils is detected and excessive overcurrent due to saturation is prevented. coil saturation protection is only enabled during the ignition state. to limit voltages and cu rrents in the resonant circuit when there is no ignition or delayed ignition, a cycle-by-cycle control mechanism is used to prevent coil saturation. this control also limits the high peak current and dissipation in the half-bridge power transistors. coil saturation is detected by mo n i toring the voltage across the r sls resistor. a trigger is generated when this voltage exceeds the v th(sat)sls level. when saturation is detected, a fixed current ? i o(sat)cf is injected into the c cf capacitor to shorten the switching cycle of the half-bridge. the injected cu rrent is maintained until the end of the switching cycle. this action immediately increases the half-bridge switching frequency. furthermore, in each successive cycle that coil saturation is detected, capacitor c ci is discharged to enable an ignition time-out detection in the ignition state. (1) v i(csi) = v ld = f(v i(dci) ) fig 10. csi voltage as a function of dci voltage 0 0 0.2 v th(hys)dci v t(hec1)dci midcurve mdl v t(hec2)dci v th(start)dci 0.9 100 % v ld v clamp(csi) internal clamp 0.4 0.6 (1) 0.8 1.0 1.2 1.4 1.6 001aam671 v t(hec3)dci 0.2 0.4 0.6 0.8 1.0 1.2 v i(dci) (v) v i(csi) [v rms ] voltage (v) voltage (v)
UBA20270 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 8 september 2011 15 of 32 nxp semiconductors UBA20270 600 v driver ic for dimmable compact fluorescent lamps coil saturation protection is triggered when the voltage on the sls pin exceeds v th(sat)sls . the voltage v sls on the sls pin is also used to se t the preheat current. the value of external resistor r sls determines this voltage. 7.4.2 overcurrent protection (ocp) ocp is active in the burn and boost states (not during boost transition). when the peak absolute value of the voltage across the current sense resistor on the sls pin exceeds the ocp reference level v th(ocp)sls , overcurrent is detected. a current i o(cp) is then sunk from the capacitor connected to the cp pin for the next full cycle. if the overcurrent is absent at the end of this cycle, the current is disabled. instead a current, also equal to i o(cp) , is sourced to the cp pin. if the overcurrent occurs in more than half the number of cycles, there is a net discharging of t he capacitor connected to the cp pin. when the voltage, on the cp pin is lower than v th(cp)min the ic enters powe r-down mode. in a continuous overcurrent condition, the overcurrent time-out of t fault(oc) takes about 1 10 t ph. the ic then enters the power-down mode. the v th(ocp)sls level corresponds with the v th(sat)sls level during the ignition state. 7.4.3 overpower protection (opp) opp is active in boost and burn state. the lamp current is limited and regulated to its nominal designed lamp current in case overvoltage situations on the mains supply occur. the overpower comes into action when the dci vo ltage, that regulates the lamp current is exceeding the maximum dci input range. inte rnally the dci voltag e is clamped to the maximum input voltage level v t(hec3)dci , see figure 10 . the dci clamp level is independent of any supply voltage fluctuations. 7.4.4 capacitive mode protection (cmp) cmp is active in the ignition, burn and boost states and during boost transition. the signal across resistor r sls also provides information about the switching behavior of the half-bridge. when conditions are normal, the current flows from the source of the ls transistor to the half-bridge when the ls tr ansistor is switched on. this results in a negative voltage on the sls pin. as the circ uit yields to capacitive mode, the voltage decreases and eventually reverses polarity. the protection prevents this condition from happening by checking if the voltage on the sls pin is higher than v th(capm)sls . if the voltage across resistor r sls is above the v th(capm)sls threshold when the ls transistor is switched on, the circuit assume s that it is in capacitive mode. when capacitive mode is detected, the currents from the ota are disabled and the capacitive mode sink current, i o(sink)ci , is enabled. this sink current discharges the capa citor/resistor circuitry on the ci pin and as a result gr adually increase the half-bridge frequency. discharge continues for the remainder of the current switching cycle, so the total current on ci is equal to the sink current. if capaci tive mode persists, the action is repeated until capacitive mode is not detected. if the capacitive mode is no longer detected, the ota starts regulating again. if the conditions causing the capacitive mode persist, the ota regulates the system back towar d s capacitive mode with the protection syst em taking control. the system operates on the edge of capacitive mode. during boost a nd burn state, if the lo ad on the half-bridge continues to be capacitive at higher frequenci es, cmp eventually drives the half-bridge to the maximum frequency f bridge(max) . from this point, the ic enters power-down mode.
UBA20270 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 8 september 2011 16 of 32 nxp semiconductors UBA20270 600 v driver ic for dimmable compact fluorescent lamps 7.4.5 power-down mode power-down mode is entered when: ? a continuous overcurrent exceeds the maximum overcurrent time-out t fault(oc) . or over a longer period if the overcurrent occurs in more than half the number of cycles as soon as v th(cp)min is reached. ? during the boost or the burn state f bridge(max) is reached due to capacitive mode detection ? two consecutive failed lamp ignition attempts occur in power-down mode, the osc illator is stopped and the hs transistor is non-conductive while the ls transistor is conductive. the v dd supply is internally cl amped. the circuit is released from power-down mode by lowering the low voltage s upply lower than v dd(rst) (mains switch reset). an option exists to set the ic in power-do wn m ode via external logic. the external power-down option is only available when the ic is in the boost or burn state. to enable the external power-down option, the cp pin is used. when pin cp, is connected via a 10 k? r esistor to either pgnd or sgnd the vo lt age on pin cp is pulled down lower than v th(pd)cp . this results in the ic entering power-down mode. remark : do no t co nnect the cp pin directly to sgnd or pgnd pin. connect the sgnd or pgnd pin via a series 10 k?? resistor otherwise excessive cu rr ents flow during reset and start-up state. excessive current pr event the ic from starting up. 7.4.6 overtemperature protection (otp) the otp circuit is designed to prevent the ic from overheating in hazardous environments. the circuit is triggered when the ic temperature exceeds the maximum temperature value t j(otp) . otp changes the lamp current to the level that corresponds to v otp(csi) level. this condition remains unt il the ic temperature reduces by 20 ? c (=t j(otp)hys ) and returns to the dci controlled level.
UBA20270 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 8 september 2011 17 of 32 nxp semiconductors UBA20270 600 v driver ic for dimmable compact fluorescent lamps 8. limiting values [1] in accordance with snw-fq-303: all pins. 9. thermal characteristics table 3. limiting values in accordance with the absolute ma ximum rating system (iec 60134). symbol parameter conditions min max unit general r ext(rref) external resistance on pin rref fixed nominal value 33 k? 30 36 k? sr slew rate on pins hbo with respect t o gnd ? 4 +4 v/ns t amb ambient temperature p = 0.8 w ? 40 85 ?c t j junction temperature ? 40 +150 ?c t stg storage temperature ? 55 +150 ?c currents i i(cf) input current on pin cf 0 200 ? a voltages v hbo voltage on pin hbo operating - 500 v during 1 second - 600 v v fs voltage on pin fs with respect to hbo ? 0.3 +14 v v dd supply voltage ? 0.3 +14 v v i(csi) input voltage on pin csi ? 5 +5 v v i(dci) input voltage on pin dci 0 5 v v i(sls) input voltage on pin sls ? 6 +6 v v ci voltage on pin ci 0 3.5 v v mdl voltage on pin mdl 0 5 v esd v esd electrostatic discharge voltage human body model: all pins, except pins 14,15 , and 16 ? 2000 +2 000 v pins 14,15, and 16 ? 10 00 +1 000 v charged device model: all pins ? 50 0 +5 00 v latch-up [1] - - - table 4. thermal characteristics symbol parameter conditions typ unit r th(j-a) thermal resistance from junction to ambient in free air; so16 package 100 k/w
UBA20270 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 8 september 2011 18 of 32 nxp semiconductors UBA20270 600 v driver ic for dimmable compact fluorescent lamps 10. characteristics table 5. characteristics v dd = 13 v; v fs - v hbo = 13 v; t amb = 25 ? c; settings according to default setting in ta ble 6 , all voltages referenced to gnd, positive currents flow into the ic, unless otherwise specified. symbol parameter conditions min typ max unit start-up state (vdd) v dd(rst) reset supply voltage high-side switch = off; low side switch = on 5.7 6.2 6.7 v v dd(stop) stop supply voltage 9.6 10.0 10.4 v v dd(start) start supply voltage 11.9 12.4 12.9 v v dd(hys) hysteresis of supply voltage 2.2 2.4 2.6 v v dd(clamp) clamp supply voltage i clamp(vdd) = 5 ma 13.0 13.4 13.8 v i dd(clamp) clamp supply current v dd = 14 v 20 30 - ma i dd(startup) start-up supply current v dd = 9 v - 190 220 ? a i dd(pd) power-down supply current v dd = 9 v - 190 220 ? a i dd supply current default setting; v dci = 1.4 v v ci = v clamp(ci), v cb = 0 v [1] - 1.6 2.0 ma high-voltage supply (ghs, hbo and fs) i leak leakage current 500 v on high-voltage pins - - 30 ? a voltage controlled oscillator output pin ic v ci(max) maximum voltage on pin ci 2.7 3.0 3.3 v v hr(ci) headroom voltage on pin ci v clamp(ci) = v hr(ci)) + v ci(max) ; burn and boost state - 80 - mv voltage controlled oscillator output pin cf f bridge(max) maximum bridge frequency c cf = 100 pf; v ci = 0 v [2] 88 100 112 khz f bridge(bst)min minimum boost bridge frequency c cf = 100 pf; v ci = v clamp(ci) [2] 21 22 23 khz f bridge(min) minimum bridge frequency c cf = 100 pf; v ci = v clamp(ci) ; v cb = 0 v [2] 38 40 42 khz t no non-overlap time v hbo rising edge 1.3 1.5 1.7 ? s v hbo falling edge 1.3 1.5 1.7 ? s v th(cf)max maximum threshold voltage on pin cf c cf = 100 pf; v ci = v clamp(ci) ; v cb = 0 v 2.40 2.50 2.60 v i o(bst)cf boost output current on pin cf v cf = 1.5 v; v ci = v clamp(ci) ? 12.3 ? 11.8 ? 11.3 ? a
UBA20270 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 8 september 2011 19 of 32 nxp semiconductors UBA20270 600 v driver ic for dimmable compact fluorescent lamps i o(cf)min minimum output current on pin cf v cf = 1.5 v; v cb = 0 v ; v ci = v clamp(ci) ? 22.8 ? 21.8 ? 20.8 ? a i o(cf)max maximum output current on pin cf v cf = 1.5 v; v cb = 0 v ? 67.0 ? 60.0 ? 53.0 ? a ga te driver output output pins gls, ghs i source(drv) driver source current v g = 4 v (gls or ghs); v hbo = 0 v; v dd = v fs = 12 v ? 105 ? 90 ? 75 ma r sink(drv) driver sink resistance v g = 2 v (gls or ghs); v hbo = 0 v; v dd = v fs = 12 v 13 15.5 18 ? table 5. characteristics ?continued v dd = 13 v; v fs - v hbo = 13 v; t amb = 25 ? c; settings according to default setting in ta ble 6 , all voltages referenced to gnd, positive currents flow into the ic, unless otherwise specified. symbol parameter conditions min typ max unit
UBA20270 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 8 september 2011 20 of 32 nxp semiconductors UBA20270 600 v driver ic for dimmable compact fluorescent lamps bootstrap diode v f forward voltage bootstrap diode; i fs = 5 ma; (v f = v dd - v fs ) 1.3 1.7 2.1 v preheat current sensor input: pin sls i i(sls) input current on pin sls v i(sls) = 0.4 v - - 1 ? a v ph(sls) preheat voltage on pin sls [3] 0.57 0.60 0.63 v output: pin ci i o(source)ci source output current on pin ci v ci = 2.0 v; v i(sls) < 0.6 v ? 10.6 ? 9.6 ? 8.6 ? a i o(sink)ci sink output current on pin ci v ci = 2.0 v; v i(sls) > 0.6 v 26 29 32 ? a preheat timer, ignition timer, overcurrent fault timer pin cp t ph preheat time c cp = 470 nf; r ext(rref) = 33 k? - 0.93 - s t en(ign) ignition enable time c cp = 470 nf; r ext(rref) = 33 k? - 0.22 - s t fault(oc) overcurrent fault time c cp = 470 nf; r ext(rref) = 33 k? ; in itial voltage v cp = 5.0 v - 0.10 - s i o(cp) output current on pin cp v cp = 4.1 v; source ( ? ) and sink (+) 5.5 5.9 6.3 ? a v th(cp)min minimum threshold voltage on pin cp - 3.8 - v v th(cp)max maximum threshold voltage on pin cp - 4.5 - v v hys(cp) hysteresis voltage on pin cp 0.6 0.7 0.8 v i pu(cp) pull-up current on pin cp v cp = 3.8 v - ? 60 - ? a v th(pd)cp power-down threshold voltage on pin cp burn state, pin cp connected to sgnd via 10 k? - 1.0 - v v th(rel)cp release threshold voltage on pin cp hold state, v dci = 1.4 v - 2.7 - v boost timer pin cb t bst boost time c cb = 470 nf; t j < 80 ?c - 148 - s i o(cb) output current on pin cb v cb = 2.35 v; source (? ) and sink (+) 0.8 1.0 1.2 ? a v th(cb)min minimum threshold voltage on pin cb - 1.1 - v table 5. characteristics ?continued v dd = 13 v; v fs - v hbo = 13 v; t amb = 25 ? c; settings according to default setting in ta ble 6 , all voltages referenced to gnd, positive currents flow into the ic, unless otherwise specified. symbol parameter conditions min typ max unit
UBA20270 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 8 september 2011 21 of 32 nxp semiconductors UBA20270 600 v driver ic for dimmable compact fluorescent lamps v th(cb)max maximum threshold voltage on pin cb - 3.6 - v v hys(cb) hysteresis voltage on pin cb 2.3 2.5 2.7 v t j(bp)bst boost bypass junction temperature t j sensed at end ignition time 65 80 95 ?c t j(end)bst boost end junction temperature t j during boost time 105 120 135 ?c i det(dis)bst boost disable detection current v cb = 0 v ? 30 ? 25 ? 20 ? a t t(bst-burn) transition time from boost to burn c cp = 470 nf; t j < 80 ?c - 3.6 - s pin csi n lcbr lamp current boost ratio v csi in boost state versus v csi in burn state; v dci = 1.34 v 1.4 1.5 1.6 coil saturation protection and overcurrent detection input: pin sls v th(sat)sls saturation threshold voltage on pin sls ignition state 2.3 2.5 2.7 v v th(ocp)sls overcurrent protection threshold voltage on pin sls boost state and burn state 2.3 2.5 2.7 v t leb leading edge blanking time detection disabled first part of g ls time - 800 - ns output: pin ci i o(sink)ci sink output current on pin ci v ci = 2.0 v; ignition state; v i(sls) > v th(sat)sls ; cycle clocked 26 29 32 ? a output: pin cf ? i o(sat)cf saturation output current difference on pin cf v cf = 1.5 v; ignition state; low-side switch = on - 160 - ? a ignition current detection input: pin csi v th(det)ign(csi) ignition detection threshold voltage on pin csi 0.55 0.60 0.65 v t w(det)ign(min) minimum ignition detection pulse width v th(det)ign(csi) = 0.75 v square pulse 685 885 1085 ns table 5. characteristics ?continued v dd = 13 v; v fs - v hbo = 13 v; t amb = 25 ? c; settings according to default setting in ta ble 6 , all voltages referenced to gnd, positive currents flow into the ic, unless otherwise specified. symbol parameter conditions min typ max unit
UBA20270 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 8 september 2011 22 of 32 nxp semiconductors UBA20270 600 v driver ic for dimmable compact fluorescent lamps capacitive mode detection input: pin sls v th(capm)sls capacitive mode threshold voltage on pin sls [4] ? 15 ? 5 0 mv output: pin ci i o(sink) ci sink output current on pin ci v sls > v th(capm)sls ; v ci = 2.0 v; ignition state or boost a nd burn state 26 29 32 ? a lamp current sensor and dimming control input: pin csi r i(csi) input resistance on pin csi v i(csi) = 1 v 1 - - m? v i(csi) = ? 1 v 40 50 60 k? v i(csi) input voltage on pin csi controlled feedback rms voltage at minimum dim level; v i(dci) = 0 v; r ext(rref) = 33 k? ; r mdl = 2.0 k? 44 50 56 mv controlled feedback rms vol t age at mid scale of l in log curve in burn state; v i(dci) = 0.9 v; r ext(rref) = 33 kw - 215 - mv voltage rectification range for l i near operation ? 2.5 - +2.5 v v clamp(csi) clamping voltage on pin csi 100 % light output; v i(dci) ? 1.34 v - 1.0 - v input: pin dci v i(dci) input voltage on pin dci minimum voltage set by mdl pin resistor v t(hec2)dci - 1.34 v r i(dci) input resistance on pin dci v i(csi) = 1 v 1 - - m? v th(bst)dci boost threshold voltage on pin dci 1.00 1.05 1.10 v v th(bst)hys(dci) hysteresis boost threshold voltage on pin dci 80 100 120 mv v th(start)dci start threshold voltage on pin dci - 0.35 - v v th(hys)dci hysteresis threshold voltage on pin dci 80 100 120 mv v t(hec1)dci human eye correction 1 transition voltage on pin dci v i(csi) = 0 v; v mdl = 0 v - 0.17 - v table 5. characteristics ?continued v dd = 13 v; v fs - v hbo = 13 v; t amb = 25 ? c; settings according to default setting in ta ble 6 , all voltages referenced to gnd, positive currents flow into the ic, unless otherwise specified. symbol parameter conditions min typ max unit
UBA20270 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 8 september 2011 23 of 32 nxp semiconductors UBA20270 600 v driver ic for dimmable compact fluorescent lamps [1] for the default setting, see table 6 . [2] switching frequency of the half-bridge output hbo. t he sa wtooth frequency on pin cf is twice as high. [3] data sampling of v ph(sls) is performed at the end of the conduction period of the low-side power mosfet, in preheat state. [4] data sampling of v th(capm)sls is performed at the start of conduction of the low-side power mosfet, in all states with oscillator active. v t(hec2)dci human eye correction 2 transition voltage on pin dci r ext(rref) = 33 k? ; r mdl = 2.0 k? ; v i(csi) = v clamp(csi) - 0.44 - v v t(hec3)dci human eye correction 3 transition voltage on pin dci v i(csi) = 1 v - 1.34 - v v otp(csi) overtemperature protection voltage on pin csi rms voltage; r ext(rref) = 33 k? ; r mdl = 2.0 k? ; v i(dci) = 1.5 v; t j > t j (otp) ? t j(otp)hys 380 400 420 mv output: pin ci i o(ci) output current on pin ci burn state; source ( ? ) and sink (+); v ci = 2.0 v 85 95 105 ? a input: pin mdl i source(mdl) source current on pin mdl ? 26.3 ? 25.0 ? 23.7 ? a v mdl voltage on pin mdl r ext(rref) = 33 k? ; r mdl = 2.0 k? - 50 - mv temperature protection t j(otp) overtemperature protection junction temperature 145 160 175 ?c t j(otp)hys hysteresis overtemperature protection junction temperature 10 20 30 ?c table 5. characteristics ?continued v dd = 13 v; v fs - v hbo = 13 v; t amb = 25 ? c; settings according to default setting in ta ble 6 , all voltages referenced to gnd, positive currents flow into the ic, unless otherwise specified. symbol parameter conditions min typ max unit
UBA20270 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 8 september 2011 24 of 32 nxp semiconductors UBA20270 600 v driver ic for dimmable compact fluorescent lamps 11. application information 11.1 design equations all equations are only valid for r ext(rref) = 33 k? 11.1.1 c cp related timing equations: ? preheat time: (1) ? ignition enabling time: (2) ? overcurrent fault time: (3) ? transition to burn time: (4) ? restart delay time: (5) where: i restart(cp) = 0.5 ? a (typical) 11.1.2 c cb related timing equations: ? boost time: (6) 11.1.3 c cf related frequency equations: ? maximum bridge frequency: (7) ? minimum bridge frequenc y with disabled boost: t ph c cp i ocp ?? -------------- 16 v hys cp ?? 5v th cp ?? max ?+ ? ?? ? = t en ign ?? c cp i ocp ?? -------------- 4v hys cp ?? ?? = t fault oc ?? c cp i ocp ?? -------------- 5v th cp ?? min ? ?? ? = t t bst burn ? ?? c cp i ocp ?? -------------- 64 v hys cp ?? 5v th cp ?? max ?+ ? ?? ? = t drestart ?? c cp i restart cp ?? ------------------------- - v th cp ?? max v th rel ?? cp ? ?? ? = t bst c cb i ocb ?? -------------- 126 v hys cb ?? v th cb ?? min 0.6 ? + ? ?? ? = f bridge max ?? 0.5 c cf c par + i ocf ?? max --------------------------- v th cf ?? max t dch + ? --------------------------------------------------------------------------- - =
UBA20270 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 8 september 2011 25 of 32 nxp semiconductors UBA20270 600 v driver ic for dimmable compact fluorescent lamps (8) ? minimum bridge frequency with enabled boost: (9) where: c par = 4.7 [pf] and t dch = 0.4 [ ? s] (typical) 11.1.4 r sls related preheat current: (10) 11.1.5 r mdl related mdl: ? mdl threshold voltage: (11) detailed in ta b l e 6 is a list of typical application components. see figure 11 . f bridge min ?? 0.5 c cf c par + i ocf ?? min --------------------------- v th cf ?? max t dch + ? --------------------------------------------------------------------------- - = f bridge bst ?? min 0.5 c cf c par + i obst ?? cf --------------------------- v th cf ?? max t dch + ? --------------------------------------------------------------------------- - = i ph m ?? v ph sls ?? r sls ------------------- - = i ph rms ?? v ph sls ?? r sls 3 ? ------------------------ - ? v mdl r mdl i source mdl ?? ? = fig 11. application diagram 001aam672 r7 r10 r9 d9 r1 r8 r mdl r ref l1 d5 d6 c cb c cf c cp c15 c16 cfl c3 r4 r sls r3 r csi r2 r6 d7 r5 q1 q2 fs hbo cb cp ci mdl rref cf 12 11 8 7 5 6 ghs gls pgnd v dd sls csi dci 14 15 16 2 4 1 9 10 c1 c2 c12 c14 c6 r11 c7 c9 c10 c13 c17 c8 l2 c5 c4 c11 d3 d4 d8 d1 d2 UBA20270 sgnd 313 table 6. typical components for a 230 v mains application reference component UBA20270 description r1 10? ? 2 w fusible resistor r2, r3 220 k? r4 22 k?
UBA20270 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 8 september 2011 26 of 32 nxp semiconductors UBA20270 600 v driver ic for dimmable compact fluorescent lamps r5, r6 330 k? r7, r10 100 k? r8 1 k? r9 1 k? r11 39 k? r ref 33 k? ; 1 % r sls 1.2 ? r mdl 1 k? r csi 8.2 ? adjust for nominal lamp current c1, c2 22 nf; 630 v c3 3.3 nf; 1000 v c4 10 ? f; 400 v c5 4.7 nf ; 1000 v lamp capacitor c6, c14 470 nf c7 100 pf c8 47 nf; 400 v c9 560 pf; 500 v v dd charge pump capacitor c10 not mounted c11 4.7 nf c12 100 nf c13 470 nf c15 220 nf c16 not mounted c17 22 nf; 400 v c cb 150 nf c cp 470 nf c cf 100 pf; 2 % q1, q2 sps02n60c3 d1 to d4 1n4007 d5, d6 1n4937 d7 bzx84jc12 d8 1n4148 l1 4.7 mh mains filter inductor; i sat = 300 ma l2 2000/2/2 ? h lamp inductor d9 1n4148 table 6. typical components for a 230 v mains application ?continued reference component UBA20270 description
UBA20270 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 8 september 2011 27 of 32 nxp semiconductors UBA20270 600 v driver ic for dimmable compact fluorescent lamps 12. package outline fig 12. package outline sot109-1 (so16) x w m a a 1 a 2 b p d h e l p q detail x e z e c l v m a (a ) 3 a 8 9 1 16 y pin 1 index unit a max. a 1 a 2 a 3 b p cd (1) e (1) (1) eh e ll p qz ywv references outline version european projection issue date iec jedec jeita mm inches 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 10.0 9.8 4.0 3.8 1.27 6.2 5.8 0.7 0.6 0.7 0.3 8 0 o o 0.25 0.1 dimensions (inch dimensions are derived from the original mm dimensions) note 1. plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 1.0 0.4 sot109-1 99-12-27 03-02-19 076e07 ms-012 0.069 0.010 0.004 0.057 0.049 0.01 0.019 0.014 0.0100 0.0075 0.39 0.38 0.16 0.15 0.05 1.05 0.041 0.244 0.228 0.028 0.020 0.028 0.012 0.01 0.25 0.01 0.004 0.039 0.016 0 2.5 5 mm scale so16: plastic small outline package; 16 leads; body width 3.9 mm sot109-1
UBA20270 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 8 september 2011 28 of 32 nxp semiconductors UBA20270 600 v driver ic for dimmable compact fluorescent lamps 13. abbreviations table 7. abbreviations acronym description cfl compact fluorescent lamp cmp capacitive mode protection dsr double-sided rectifier esd electrostatic discharge hs high-side ls low-side mdl minimum dimming level ocp overcurrent protection opp overpower protection ota operational transconductance amplifier otp overtemperature protection rms root mean square sr slew rate uvlo undervoltage lockout vco voltage controlled oscillator
UBA20270 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 8 september 2011 29 of 32 nxp semiconductors UBA20270 600 v driver ic for dimmable compact fluorescent lamps 14. revision history table 8. revision history document id release date data sheet status change notice supersedes UBA20270 v.2 20110908 prroduct data sheet - UBA20270 v.1 UBA20270 v.1 20110816 preliminary data sheet - -
UBA20270 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 8 september 2011 30 of 32 nxp semiconductors UBA20270 600 v driver ic for dimmable compact fluorescent lamps 15. legal information 15.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of mu ltiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 15.2 definitions draft ? the document is a draft versi on only . the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet wit h the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product dat a sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 15.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. in no event shall nxp semiconductors be lia ble fo r any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason what soe ver, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes t o information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, aut hor ized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these prod uct s are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and pr oduct s using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liabil i ty related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in th e absolute maximum ratings system of iec 60134) will cause permanent damag e to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors prod uct s are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agre ement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or co nstr ued as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may b e subject to export control regulations. export might require a prior authorization from national authorities. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objec tive specif icati on for product development. preliminary [short] data sheet qualification this document contains data from t he preliminary specification. product [short] data sheet production this document contains the product specification.
UBA20270 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 8 september 2011 31 of 32 nxp semiconductors UBA20270 600 v driver ic for dimmable compact fluorescent lamps non-automotive qualified products ? unless this data sheet expressly stat es that this specific nxp semicon ductors product is automotive qualified, the product is not suitable for automotive use. it is neither qualified nor tested in accordance with automotive testing or application requirements. nxp semiconductors accepts no liabili ty for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. in the event that customer uses t he pro duct for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without nxp semiconductors? warranty of the product for such automotive applicat ions, use and specifications, and (b) whenever customer uses the product for automotive applications beyond nxp semiconductors? specifications such use shall be solely at customer?s own risk, and (c) customer fully indemnifies nxp semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive app lications beyond nxp semiconductors? standard warranty and nxp semiconduct ors? product specifications. 15.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 16. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
nxp semiconductors UBA20270 600 v driver ic for dimmable compact fluorescent lamps ? nxp b.v. 2011. all rights reserved. for more information, please visit: http://www.nxp.com ? for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 8 september 2011 document identifier: UBA20270 please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 17. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 2.1 half-bridge features . . . . . . . . . . . . . . . . . . . . . 1 2.2 preheat and ignition features . . . . . . . . . . . . . . 1 2.3 lamp boost features . . . . . . . . . . . . . . . . . . . . . 1 2.4 dim features . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2.5 protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.6 other features. . . . . . . . . . . . . . . . . . . . . . . . . . 2 3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 4 ordering information . . . . . . . . . . . . . . . . . . . . . 2 5 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 pinning information . . . . . . . . . . . . . . . . . . . . . . 4 6.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 6.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 functional description . . . . . . . . . . . . . . . . . . . 5 7.1 lamp start-up cycle . . . . . . . . . . . . . . . . . . . . . 6 7.1.1 reset state . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 7.1.2 start-up state . . . . . . . . . . . . . . . . . . . . . . . . . . 6 7.1.3 preheat state . . . . . . . . . . . . . . . . . . . . . . . . . . 6 7.1.4 ignition state . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 7.1.5 boost state and transition to burn state . . . . . . 8 7.1.6 burn state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 7.1.7 hold state . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 7.2 oscillation and timing . . . . . . . . . . . . . . . . . . . 11 7.2.1 oscillation . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 7.2.2 combined timing circuit . . . . . . . . . . . . . . . . . 12 7.3 natural linear dimming . . . . . . . . . . . . . . . . . . 13 7.4 protection and power-down . . . . . . . . . . . . . . 14 7.4.1 coil saturation protection . . . . . . . . . . . . . . . . 14 7.4.2 overcurrent protection (ocp) . . . . . . . . . . . . 15 7.4.3 overpower protection (opp) . . . . . . . . . . . . . 15 7.4.4 capacitive mode protection (cmp) . . . . . . . . 15 7.4.5 power-down mode . . . . . . . . . . . . . . . . . . . . . 16 7.4.6 overtemperature protecti on (ot p) . . . . . . . . 16 8 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 17 9 thermal characteristics . . . . . . . . . . . . . . . . . 17 10 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 18 11 application information. . . . . . . . . . . . . . . . . . 24 11.1 design equations . . . . . . . . . . . . . . . . . . . . . . 24 11.1.1 c cp related timing equations: . . . . . . . . . . . . 24 11.1.2 c cb related timing equations: . . . . . . . . . . . . . 24 11.1.3 c cf related frequency equations: . . . . . . . . . . 24 11.1.4 r sls related preheat current: . . . . . . . . . . . . . 25 11.1.5 r mdl related mdl: . . . . . . . . . . . . . . . . . . . . . 25 12 package outline . . . . . . . . . . . . . . . . . . . . . . . . 27 13 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 28 14 revision history . . . . . . . . . . . . . . . . . . . . . . . 29 15 legal information . . . . . . . . . . . . . . . . . . . . . . 30 15.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 30 15.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 15.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 30 15.4 trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 31 16 contact information . . . . . . . . . . . . . . . . . . . . 31 17 contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

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